台灣做3G晶片的design house

國內手機製造廠商近日傳出數名資深工程師前往竹北IC設計公司瑞銘科技任職,經查證,瑞銘大股東為聯電持股九九. 九九%的宏誠創投,主要產品為PHS手機及TDSCDMA三G手機等晶片開發。這是台灣IC設計界繼聯發科、凌陽、及威盛之後,第四家投入三G手機晶片開 發的IC設計公司。

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